A method for predicting such failure was proposed which involved using atomic flux divergences. The lifetimes and failure sites for a polycrystalline line were predicted by numerically simulating void initiation and their growth to give line failure; with changes in the distribution of current density and temperature with void growth being taken into account. The usefulness of this prediction method was verified by using experiments involving an angled Al line. The failure location was determined by the line-shape and operating conditions. The present simulations accurately predicted the lifetimes as well as the failure locations of metal lines.

A Method to Predict Electromigration Failure of Metal Lines. K.Sasagawa, K.Naito, M.Saka, H.Abé: Journal of Applied Physics, 1999, 86[11], 6043-51