The mobilities of individual adatoms, and of various structural elements of the O/Cu system, were analyzed on the basis of scanning tunnelling microscopic data. A value of about x 10-14cm2/s was estimated for the self-diffusivity of Cu on the base (110) surface at 300K. This was deduced from the motion of steps. The supply of Cu adatoms by evaporation from steps, rather than the migration of individual Cu adatoms on the terraces was the rate-limiting process in the so-called added-row reconstruction process.

J.Wintterlin, R.Schuster, D.J.Coulman, G.Ertl, R.J.Behm: Journal of Vacuum Science and Technology B, 1991, 9[2], 902-8

 

Table 85

Grain-Boundary Diffusion in Cu

 

Purity

Temperature (K)

δD (m3/s)

5N8

1066

1.08 x 10-19

5N8

1050

1.15 x 10-19

5N

973

3.10 x 10-20

5N8

968

4.49 x 10-20

5N

923

1.97 x 10-20

5N

877

1.08 x 10-20

5N8

872

1.78 x 10-20

5N8

825

1.08 x 10-20

5N8

817

9.70 x 10-21

5N

784

2.57 x 10-21

5N8

777

5.60 x 10-21

5N8

740

2.67 x 10-21

5N8

720

2.16 x 10-21