The interdiffusion of couples of pure Cu and Cu-6.54 .or Cu-9.76at%Si alloy was studied by using electron probe micro-analytical techniques. It was found (table 105) that the activation energy at 0at%Si corresponded to that for Si diffusion in Cu. These were smaller than that for self-diffusion in Cu.

Y.Minamino, T.Yamane, T.Kimura, T.Takahashi: Journal of Materials Science Letters, 1988, 7[4], 365-7

 

Table 107

Diffusion of 113Sn in Cu-15at%Sn

 

Temperature (K)

D (m2/s)

1024.3

1.86 x 10-11

998.1

1.15 x 10-11

971.9

8.28 x 10-12

946.4

5.70 x 10-12

920.7

3.89 x 10-12

894.8

2.22 x 10-12