The interdiffusion of couples of pure Cu and Cu-6.54 .or Cu-9.76at%Si alloy was studied by using electron probe micro-analytical techniques. It was found (table 105) that the activation energy at 0at%Si corresponded to that for Si diffusion in Cu. These were smaller than that for self-diffusion in Cu.
Y.Minamino, T.Yamane, T.Kimura, T.Takahashi: Journal of Materials Science Letters, 1988, 7[4], 365-7
Table 107
Diffusion of 113Sn in Cu-15at%Sn
Temperature (K) | D (m2/s) |
1024.3 | 1.86 x 10-11 |
998.1 | 1.15 x 10-11 |
971.9 | 8.28 x 10-12 |
946.4 | 5.70 x 10-12 |
920.7 | 3.89 x 10-12 |
894.8 | 2.22 x 10-12 |