The diffusion kinetics of chemical vapour deposited materials were studied by using electron microprobe techniques. Line-scans of Ir and Re were fitted, and a diffusion model was used to deduce the diffusion coefficients (table 127). It was noted that the most rapid diffusion process was grain boundary diffusion, with Re diffusing down grain boundaries in the Ir overlayer.
J.C.Hamilton, N.Y.C.Yang, W.M.Clift, D.R.Boehme, K.F.McCarty, J.E.Franklin: Metallurgical Transactions A, 1992, 23[3], 851-6
Table 127
Interdiffusion of Ir and Re
Temperature (C) | D (cm2/s) |
1400 | 7.0 x 10-12 |
1700 | 2.9 x 10-11 |
1900 | 4.7 x 10-11 |