The laws of melt formation, and subsequent solid-liquid interaction between Ni substrates and Ti thin films at 1050, 1150 and 1250C (for 0.25 to 1h), were studied. This permitted solid-phase diffusion of Ti from the melt, and into the Ni substrate, to be investigated. At 1250C, for a solid solution of Ti in Ni and parabolic layer growth, the growth-rate constant was 2.1 x 10-12m2/s and the mutual diffusion coefficient was equal to 1.8 x 10-13 m2/s.

L.P.Efimenko, L.P.Petrova: Russian Metallurgy, 1998, [5], 145-50