Electromigration was a major road block in the pursuit of further miniaturized electronics. In the next generation micro and sub-micro electronics current density was expected to exceed 107A/cm2. An electromigration induced strain-current density model was proposed here and was implemented into a finite-element procedure for the solution of boundary/initial value electromigration problems. Numerical simulations were compared with experimental data. The comparisons validated the model.

Electromigration Induced Stress Analysis using Fully Coupled Mechanical–Diffusion Equations with Nonlinear Material Properties. M.Lin, C.Basaran: Computational Materials Science, 2005, 34[1], 82-98