Grain-boundary stresses in Cu for 60 symmetrical tilt grain boundaries with different orientations of the grain-boundary plane and tilt axis were calculated by the molecular-statics method with the use of embedded-atom-method potentials of interatomic interaction. It was established that the grain-boundary stresses were negative for grain boundaries with small excess volumes and increased approximately linearly with a buildup of the excess volume. It was shown that the increase in grain-boundary stresses was connected with a decrease in the average coordination number of atoms, whereas pairs of closely spaced atoms in the grain-boundary core cause a negative contribution to grain-boundary stresses.

Studying Grain-Boundary Stresses in Copper by the Molecular-Statics Method. A.G.Lipnitskii, A.V.Ivanov, Y.R.Kolobov: The Physics of Metals and Metallography, 2006, 101[3], 303-8