The grain growth which occurred during the self-annealing in Cu electrodeposits was investigated by in situ observation with an electron back-scattered diffraction technique. From these observations, it was found that a newly created twin was initiated on the front interface of growing twin and that the transverse direction for the growth was <110>. Most of the twins had the Σ3 twin boundary of {111},<110>. The formation of the twin and its peculiar growth direction could be explained quite well based upon the hypothesis that the growth front interface was one of the {111} planes.

In situ Observation of the Grain Growth of the Copper Electrodeposits for Ultralarge Scale Integration. H.J.Lee, H.N.Han, D.H.Kim, U.Lee, K.H.Oh, P.R.Cha: Applied Physics Letters, 2006, 89[16], 161924 (3pp)