Interdiffusion experiments of Cu and Al were carried out under a high magnetic field of up to 12T. It was observed that uniform magnetic fields exerted a non-monotonic influence on the thickness of diffusion layers. This phenomenon could be attributed to the effects of high magnetic fields suppressing natural convection and inducing thermo-electromagnetic convection at Cu/Al solid/liquid interface.

Effects of High Uniform Magnetic Fields on Diffusion Behavior at the Cu/Al Solid/liquid Interface. Q.Wang, D.Li, K.Wang, Z.Wang, J.He: Scripta Materialia, 2007, 56[6], 485-8