The evolution of grain boundaries in pure Ni was studied after sintering at 900, 1100 and 1300C. It was found that the fraction of low-angle grain boundaries remained more or less constant over this sintering temperature range. However, the fraction of random boundaries decreased and that of Σ3 boundaries increased with increasing sintering temperature. The observations on grain boundary character distribution were found to correlate well with the accompanying microstructural changes.

Effect of Sintering Temperature on Grain Boundary Character Distribution in Pure Nickel. P.P.Bhattacharjee, S.K.Sinha, A.Upadhyaya: Scripta Materialia, 2007, 56[1], 13-6