The crystallographic texture and microstructure of electrolytic tough pitch Cu were investigated by electron back-scattering diffraction after cold wire drawing (reduction in area between 52 and 94%) and after primary recrystallization. The material exhibited a deformation texture which was composed of major <111> and minor <100> fibres. The evolution of the quality index of the Kikuchi patterns showed that the stored energy was lower in the <100> fibre than in the <111> fibre. Then, after recrystallization, the volume fraction of the <100> fibre increased at the expense of the other texture components. The study of the grain boundary nature showed that the recrystallization twin fraction decreased with increasing strain. It was shown that this evolution was a consequence of grain size reduction.

Annealing Twin Formation and Recrystallization Study of Cold-Drawn Copper Wires from EBSD Measurements. T.Baudin, A.L.Etter, R.Penelle: Materials Characterization, 2007, 58[10], 947-52