The interactions of moving twin boundaries with stacking fault tetrahedra were studied by molecular dynamics. The results revealed a spectrum of processes occurring during these interactions. In general, they led to damage of the parent stacking fault tetrahedron and formation of new defects in the twin lattice. The character of these defects depended upon the nature of the twinning front, the size of the stacking fault tetrahedron and its orientation with respect to incoming dislocations. Typical structures that could be produced in the twin included product- stacking fault tetrahedra, free vacancies, planar stacking faults bounded by partial dislocations, mutually linked stacking faults on non-coplanar {111}T planes, small {111}T tetrahedra and their partial forms. Dislocation mechanisms involvedin the formation of these defects were being analyzed.

Molecular Dynamic Studies of the Interaction of a/6〈112〉 Shockley Dislocations with Stacking Fault Tetrahedra in Copper. Part II - Intersection of Stacking Fault Tetrahedra by Moving Twin Boundaries. M.Niewczas, R.G.Hoagland: Philosophical Magazine, 2009, 89[8], 727-46