Electromigration through a Cu/Sn3.5Ag/Au solder joint resulted in rotation of the intermetallic compounds. The Sn whiskers induced within the unreacted solder were believed to be due to the mechanical stress induced by this intermetallic compound rotation. Microstructural investigation and the electron diffraction pattern, revealed by transmission electron microscopy, indicated that the crystalline Sn whiskers grew with inclusion of prominent dislocations. The existence of dislocations within the Sn whiskers suggested that whisker growth experienced turbulence.

The Growth of Sn Whiskers with Dislocation Inclusion upon Electromigration through a Cu/Sn3.5Ag/Au Solder Joint. T.C.Chiu, K.L.Lin: Scripta Materialia, 2009, 60[12], 1121-4