A multiple-grain phase-field model was used to study the formation of wavy bond lines in transient-liquid-phase diffusion bonding. Simulations showed that the prime condition of unidirectional interface migration could be achieved under significantly smaller temperature gradients than those predicted by analytical models. They also showed that morphological instabilities might form not only during solidification, but also during melting, i.e. on the retreating interface. Formation of melting perturbations was explained in light of a tailored version of the constitutional undercooling criterion.

Modelling of Microstructure Evolution in Transient-Liquid-Phase Diffusion Bonding under Temperature Gradient. M.A.Jabbareh, H.Assadi: Scripta Materialia, 2009, 60[9], 780-2