The unexpected glide of dislocations, on a plane parallel to the film/substrate interface in ultra-thin metallic films (parallel glide) was described by using an analytical model. The phenomenon was seen as being a problem involving inlet/outlet flow from differing positions of a grain boundary into the grain channel. In this sense, parallel glide was presented as the flow of dislocations with an internal stress source/sink distribution.

Parallel Glide - Flow of Dislocations with Internal Stress Source/Sink Distribution. K.T.Raić: Science and Technology of Advanced Materials, 2008, 9[1], 015008