Yielding and strain hardening in metallic thin films on substrates were studied using a simple edge dislocation climb model, modified to mimic dislocation processes in passivated, single crystal face-centered cubic metal films with a (111) texture. The aim of the modelling was to produce closed-form solutions for the yield strength and rate of strain hardening that could be compared with experiment. The models gave a good account of the dependence of the yield strength of passivated gold films on silicon substrates on the film thickness and they were in broad agreement with the experimental observation that plastic flow in passivated metal films was characterized by very high rates of strain hardening. However, these simple models fail to predict the observed decrease in the rate of strain hardening with increasing film thickness, a result that required more computationally intensive discrete dislocation modelling. Yielding and Strain Hardening in Metallic Thin Films on Substrates - an Edge Dislocation Climb Model. W.D.Nix: Mathematics and Mechanics of Solids, 2009, 14[1-2], 207-19