A numerical modelling, which was hierarchically coupled with the crystal plasticity finite element method and discrete dislocation dynamics, was performed to examine thermal fatigue behavior of via pattern in ultra-large-scale copper interconnections. The pattern had a pillar shape and one of three crystallographic orientations, <001>, <110> and <111>, along its longitudinal direction. The internal stress and surface morphology on via patterns could be obtained considering the generation of dislocations and their motion. A robust via pattern in terms of crystallographic orientation was suggested.

A Discrete Dislocation Dynamics Modeling for Thermal Fatigue of Preferred Oriented Copper via Patterns. G.S.Kim, M.C.Fivel, H.J.Lee, C.Shin, H.N.Han, H.J.Chang, K.H.Oh: Scripta Materialia, 2010, 63[7], 788-91