The plastic deformation of nanocrystalline copper subjected to tension was studied using molecular dynamics simulation. The results show that, in the initial stage, the deformation was mainly boundary-mediated in small grains; while in the late stage, the deformation was accommodated by dislocations in large grains. It was also found that the stress-assisted grain growth occurs owing to atomic diffusion and grain boundary migration. These results were consistent with recent experimental observations.

Roles of Grain Boundary and Dislocations at Different Deformation Stages of Nanocrystalline Copper under Tension. Y.G.Zheng, H.W.Zhang, Z.Chen, C.Lu, Y.W.Mai: Physics Letters A, 2009, 373[5], 570-4