An investigation was made of the influence of pulse current density upon the crystallographic microstructure of twin Cu films through X-ray diffraction and electron back-scatter diffraction. With an increase in the pulse current density, the intensity of the preferred orientation (texture), grain size and the fraction of the twins decreased. The high-density twin copper films, including the nanotwins observed from the orientation image maps, were achieved using a pulsed electrodeposition technique at the current density of 0.5A/cm2, with an average grain size of 818nm. The crystallographic microstructure of the high-density twin copper films shows a <011> preferred orientation associated with the 60°<111> twin having a {111} twin plane.

EBSD Characterization of Twinned Copper using Pulsed Electrodeposition. G.T.Lui, D.Chen, J.C.Kuo: Journal of Physics D, 2009, 42[21], 215410