In order to clarify the W diffusion behavior at the WCu/Ni interface, a WCu/Ni diffusion couple was prepared, and the phase structure and constituents of the diffusion layer were characterized by a scanning electron microscopy and transmission electron microscopy. Based on the experimental data, the interdiffusion coefficient was calculated. The diffusion behavior was also verified by the simulation according to the first principle method. The results showed that a diffusion layer with the thickness of 1μm, which was composed of Cu rich solid solution and W rich solid solution, was formed on the surface of W particles. The interdiffusion coefficient of W in the transitional layer was 3.381 x 10−15cm2/s, which was much larger than that of W in Ni. This was in good agreement with the simulation result.

Diffusion Behavior of W in the WCu/Ni Interface. J.Cui, S.Liang, W.Yue, X.Wang: International Journal of Refractory Metals and Hard Materials, 2011, 29[2], 153-7