Plastically deformed (hand-filed) Cu–Sn–5Zn ternary alloys with Sn concentrations of 1, 2.5 and 5wt% were investigated. Microstructural parameters were studied in terms of X-ray diffraction profile fitting analysis. It was observed by Dey et alia that the change in stacking fault probability with Sn concentration for ternary Cu–Sn–5Zn alloys was similar to Cu-based binary alloy (Cu–Sn) system but behaves in a different manner from Cu–1Sn–Zn ternary alloy systems. The crystallite size distribution was broader for alloy with 1wt%Sn and became narrower with increasing Sn concentration. Value of dislocation density was of the order of 1015/m2 and showed a compositional dependence. Type of dislocation was found to be predominantly screw; <100>-type dipoles could also be present in the cold-worked alloys. The dislocation arrangement was found to be more correlated in case of 1wt%Sn compared to other alloys of higher Sn concentration. The stacking fault energy was obtained from modified Reed-Schramm equation and was of the order of 20mJ/m2 with no significant compositional dependence.

Deformation Stacking Fault Probability and Dislocation Microstructure of Cold Worked Cu–Sn–5Zn Alloys by X-Ray Diffraction Line Profile Analysis. S.N.Dey, P.Chatterjee, S.P.Sen Gupta: Journal of Applied Physics, 2006, 100[7], 073509 (6pp)