It was noted that electroplated material underwent a recrystallization at room temperature which was related to the presence of organic and inorganic additives in the plating bath. In the as-plated condition, the Cu grains were small (0.1μm) and equiaxed. However, over periods ranging from hours to days, recrystallization resulted in grains that were several μm in size. A significant weakening of the strong as-plated (111) texture was revealed by X-ray diffraction pole figure measurements, and an increase in the level of randomness. It was proposed that multiple twinning was the main mechanism that was involved in this phenomenon.

Texture Development of Blanket Electroplated Copper Films. C.Lingk, M.E.Gross, W.L.Brown: Journal of Applied Physics, 2000, 87[5], 2232-6