Molecular dynamics simulations on diffusion bonding of Cu-Ag showed that the thickness of the interfacial region depended upon the stress. The interfacial region became amorphous during diffusion bonding, and it would normally transform from amorphous into crystalline structure when the structure was cooled to room temperature.

Molecular Dynamics Modelling of Diffusion Bonding. Chen, S.D., Soh, A.K., Ke, F.J.: Scripta Materialia, 2005, 52[11], 1135-40