The diffusion of Cu, Fe, and Si in Ni-24.9at% was studied at 1373 to 1573K by using diffusion couples (figure 10). It was found that the temperature dependences of the diffusion coefficients could be described by:

Cu:     D(m2/s) = 1.28 x 10-2exp[-331(kJ/mol)/RT]

Fe:     D(m2/s) = 1.28 x 10-2exp[-335(kJ/mol)/RT]

Si:     D(m2/s) = 8.51 x 10-2exp[-363(kJ/mol)/RT]

The activation energies were found to be closely related to the substitution behavior of Cu, Fe and Si atoms in the L12 lattice sites of '.

Diffusion of Copper, Iron and Silicon in Ni3Al. Jung, S.B., Minamino, Y., Araki, H., Yamane, T., Hirao, K., Saji, S.: Defect and Diffusion Forum, 1993, 95-98, 859-64

Table 13

Bulk diffusivity of 67Ga in Ni3Al

 

Al(at%)

Temperature(K)

D(m2/s)

24.8

1373

1.5 x 10-15

24.8

1273

1.2 x 10-16

23.8

1373

2.2 x 10-15

23.8

1273

1.7 x 10-16

23.8

1173

9.5 x 10-18

22.4

1373

3.5 x 10-15

22.4

1273

3.6 x 10-16

22.4

1173

2.0 x 10-17