Detailed measurements were made of Au concentration profiles in [110]-type wafers of p-type material. The Au was introduced by means of ion implantation, and was diffused at 1073 to 1473K for 60s to 100h. Resistivity profiles were converted into Au concentration profiles by using the entropy factor for the ionization of the Au donor level. It was suggested that the measured profiles and their time dependence could be explained in terms of the kick-out diffusion mechanism. It was found that the diffusivity was described by:

D (cm2/s) = 2.1 x 10-2 exp[-1.7(eV)/kT]

S.Coffa, L.Calcagno, S.U.Campisano, G.Calleri, G.Ferla: Journal of Applied Physics, 1988, 64[11], 6291-5

The best linear fits to the solute diffusion data ([124] to [129], [133] to [144], [146] to [176], [188] to [192], [196] to [211], [215] to [223], [234] to [242], [252] to [283], [292] to [298], [306] to [314]) yield:

Al: Ln[Do] = 0.45E – 32.8 (R2 = 0.81); As: Ln[Do] = 0.29E – 23.2 (R2 = 0.87);

Au: Ln[Do] = 0.16E – 12.4 (R2 = 0.16); B: Ln[Do] = 0.29E – 22.6 (R2 = 0.79);

Cu: Ln[Do] = 0.22E (R2 = 0.86); Fe: Ln[Do] = 0.62E – 15.8 (R2 = 0.53);

Ga: Ln[Do] = 0.20E - 16.9 (R2 = 0.78); Ge: Ln[Do] = 0.29E – 23.2.8 (R2 = 0.98);

H: Ln[Do] = 0.17E - 9.9 (R2 = 0.07); Li: Ln[Do] = 0.25E – 9.6 (R2 = 0.48);

Ni: Ln[Do] = 0.29E - 19.4 (R2 = 0.66); O: Ln[Do] = 0.34E – 21.6 (R2 = 0.95);

P: Ln[Do] = 0.35E - 27 (R2 = 0.94); Sb: Ln[Do] = 0.35E – 29.3 (R2 = 0.96);

Si: Ln[Do] = 0.33E - 29 (R2 = 0.86)