The migration of ion-implanted Au in a Si monocrystal was studied by using the spreading resistance method. One-dimensional and 2-dimensional diffusion across the wafer and along the wafer were studied by using limited or unlimited Au sources. The data could be described by:

D (cm2/s) = 2.8 x 10-1 exp[-1.6(eV)/kT]

It was shown that, by ion-implanting Au, it was possible to produce unique concentration profiles via close control of the number of Au atoms in the diffusion source. All of the measured profiles were consistent with a kick-out mechanism for Au diffusion in Si.

S.Coffa, L.Calcagno, S.U.Campisano, G.Ferla: Journal of Applied Physics, 1991, 69[3], 1350-4

The best linear fits to the solute diffusion data ([124] to [129], [133] to [144], [146] to [176], [188] to [192], [196] to [211], [215] to [223], [234] to [242], [252] to [283], [292] to [298], [306] to [314]) yield:

Al: Ln[Do] = 0.45E – 32.8 (R2 = 0.81); As: Ln[Do] = 0.29E – 23.2 (R2 = 0.87);

Au: Ln[Do] = 0.16E – 12.4 (R2 = 0.16); B: Ln[Do] = 0.29E – 22.6 (R2 = 0.79);

Cu: Ln[Do] = 0.22E (R2 = 0.86); Fe: Ln[Do] = 0.62E – 15.8 (R2 = 0.53);

Ga: Ln[Do] = 0.20E - 16.9 (R2 = 0.78); Ge: Ln[Do] = 0.29E – 23.2.8 (R2 = 0.98);

H: Ln[Do] = 0.17E - 9.9 (R2 = 0.07); Li: Ln[Do] = 0.25E – 9.6 (R2 = 0.48);

Ni: Ln[Do] = 0.29E - 19.4 (R2 = 0.66); O: Ln[Do] = 0.34E – 21.6 (R2 = 0.95);

P: Ln[Do] = 0.35E - 27 (R2 = 0.94); Sb: Ln[Do] = 0.35E – 29.3 (R2 = 0.96);

Si: Ln[Do] = 0.33E - 29 (R2 = 0.86)