Electrochemical deposition of Al and Pb from basic molten AlCl3-NaCl-KCl mixtures onto an aluminum electrode at 180C was studied using voltammetry, potential and current transient and constant current deposition. The deposition of Al was found to proceed via a nucleation/growth mechanism, while the deposition of Pb was diffusion-controlled. The diffusion coefficient calculated for Pb2+ ions in basic melts by voltammetry was in agreement with the deductions of transient methods, and was equal to 8 x 10-6cm2/s. Analysis of the chronoamperograms indicated that the deposition of Pb onto Al substrates was controlled by 3D diffusion control, nucleation and growth. The processes were manifested as peaks on a decaying chronoamperogram.

Electrocrystallization of Pb and Pb Assisted Al on Aluminum Electrode from Molten Salt (AlCl3-NaCl-KCl). M.Jafarian, I.Danaee, A.Maleki, F.Gobal, M.G.Mahjani: Journal of Alloys and Compounds, 2009, 478[1-2], 83-8

 

Table 49

Diffusivity of Co2+ Ions in CsCl Melts

 

CoCl2 (/cm3)

Temperature (C)

D (cm2/s)

1.420 x 105

700

0.77 x 10-5

1.670 x 105

700

0.73 x 10-5

1.761 x 105

700

1.66 x 10-5

1.365 x 105

806

1.02 x 10-5

1.395 x 105

806

1.75 x 10-5

1.480 x 105

806

2.01 x 10-5