The grain boundary diffusion of Cu(II) and Fe(III) ions in the CuCl solid phase was studied. Structural compaction and increasing conductivity of the CuCl surface layer resulted from the diffusion. The diffusion of Fe(III) heterocations in the inner CuCl layers decreased during diffusion of Cu(I) particles over the grain boundaries and the competitive diffusion of Cu(II) ions. The change in the grain boundary diffusion coefficient of Fe(III) ions ranged from 1.33 x 10-13 to 2.4·x 10-12cm2/s.

Grain Boundary Diffusion of Heterocations in Polycrystalline CuCl Layer. V.I.Larin, E.B.Khobotova, V.S.Kublanovskij: Ukrainskij Khimicheskij Zhurnal, 2005, 71[1-2], 52-6