Cyclic voltammetry, chronopotentiometry and chronoamperometry were used to study reaction mechanisms and electrocrystallization in a NaCl-KCl-CuCl2 system at 700C. While Cu appeared or electrodeposition continued, Cu2+ could be reduced to Cu+. The electrochemical reaction of Cu was a quasi-reversible process controlled by Cu ion diffusion and electron rate. The electrochemical reaction mechanism was Cu+ + e-→Cu. The copper electrocrystallization process was an instantaneous hemispheroid three-dimensional nucleation process, and the Cu ion diffusion coefficient was 2.5 x 10-4cm2/s.

Electrochemical Behavior of Copper in the (NaCl-KCl-CuCl2) Molten Salt. Y.Li, K.Zhang, J.Li, L.Liu: Applied Mechanics and Materials, 2012, 217-219, 8-14