The electrochemical reaction mechanism and electrocrystallization process of Cu on copper electrodes in eutectic NaCl-KCl-CuCl melts were investigated by using cyclic voltammetry, chronopotentiometry and chronoamperometry techniques at 710C. The results showed that the electrochemical reaction of Cu was a quasi-reversible process controlled by Cu+ diffusion and electron transport; the electrochemical reduction mechanism being Cu+ + e → Cu. The electrocrystallization process of copper was an instantaneous hemispheroid three-dimensional nucleation process. The Cu+ diffusion coefficient was 4.3 x 10-4cm2/s.

Electrochemical Behavior of Cu in the (NaCl-KCl-CuCl) Molten Salt. Y.Li, J.Li, K.Zhang, L.Liu: Acta Metallurgica Sinica, 2011, 24[6], 466-72