The diffusion of Cu through electron-beam evaporated thin films was studied by monitoring electrical resistance changes, as a function of time, at 343 to 543K:

D (cm2/s) = 4.60 x 10-13 exp[-0.40(eV)/kT]

R.Roy, S.K.Sen: Thin Solid Films, 1993, 223[1], 189-95