The diffusion of Cu through ion-plated pure Ag layers was studied at 363 to 523K. The results could be described by:

D (cm2/s) = 2.3 x 10-5 exp[-0.68(eV)/kT]

A.Bukaluk, M.Rozwadowski, R.Siuda: Surface Science, 1988, 200, 381-5