The diffusive behavior of Cu was studied in monocrystalline and polycrystalline material at 860 to 970C. The results could be described by:

polycrystalline:     D (cm2/s) = 1.0 x 10-1 exp[-1.96(eV)/kT]

monocrystalline:     D (cm2/s) = 6.0 x 10-1 exp[-2.13(eV)/kT]

M.S.Maier, H.Nelson: Transactions of the AIME, 1942, 147, 39