Diffusion in oxide dispersion-strengthened material was measured by plating wire specimens with Ni, and annealing at 775 to 1025C. There was little difference in the diffusivities of O-free high-conductivity Cu and oxide-dispersed material at high temperatures; where bulk diffusion was expected to predominate. When below about 950C, the diffusivity in oxide-dispersed material became increasingly larger than that in pure Cu as the temperature decreased. The diffusivity of the oxide-dispersed material, below 950C, was described by:

D (cm2/s) = 6.79 x 10-5 exp[-29.2(kcal/mol)/RT]

J.W.Pugh, R.F.Hehemann, D.J.Diederich: Metallurgical Transactions A, 1980, 11[12], 2036-8