An assessment was made of the influence of stacking-fault energy on the high-temperature creep of Cu (55mJ/m2) and Cu-4Si (25mJ/m2). An attempt was made to show that the role of an energy behaviour law was in accord with literature results. In general, data analysis proved that the creep of copper was not controlled by bulk or pipe diffusion but was the result of thermally activated slip; probably due to cross-slip. In the case of Cu-4Si, the stacking-fault energy was half of that of Cu and cross-slip proved to be harder, so creep could be controlled by both diffusion and cross-slip.

The Influence of Stacking Fault Energy on High Temperature Creep Behaviour Laws: the Case of Cu and Cu-4Si. M.Retima, H.Chadli: Physics Procedia, 2009, 2[3], 1281-4