Equilibrated grain-boundary grooves of solid Sn in contact with Sn-Cu eutectic liquid were observed in quenched samples. The Gibbs-Thomson coefficient, solid/liquid interfacial energy and grain-boundary energy of solid Sn were deduced to be 8.7 x 10-8Km, 113.1mJ/m2 and 222.4mJ/m2, respectively.

Thermal Conductivity and Interfacial Energies of Solid Sn in the Sn-Cu Alloy. Y.Kaygisiz, Y.Ocak, S.Aksöz, N.Maraşli, K.Keşlioǧlu, E.Çadirli, H.Kaya: Chemical Physics Letters, 2010, 484[4-6], 219-24