The kinetics of solid-state reaction at the interface of a Cu/Zn bulk diffusion couple, subjected to compressive plastic deformation, were studied as a function of plastic strain, strain-rate and temperature. The experimental data were analyzed in terms of classical atomic transport theory, and the effect of plastic deformation upon the growth rate of the reaction product was also considered. The diffusion coefficient at 150C (which was larger, than the purely thermal value at the same temperature, by some 4 orders of magnitude) was almost independent of temperature and was linearly dependent upon the strain-rate at which deformation occurred. The only parameter which controlled the thickness of the reacted layer appeared to be the total strain which was experienced by the diffusion couple. This plastically-enhanced diffusivity was consistent with a simple model for the behavior of the excess point defects that were created by plastic deformation. The model was similar to that used to describe radiation-enhanced diffusion.

Effect of Plastic Deformation on the Kinetics of the Solid-State Reaction between Cu and Zn. M.Angiolini, G.Mazzone, A.Montone, M.Vittori-Antisari: Physical Review B, 1999, 59[18], 11733-8