Previous data on diffusion-induced grain-boundary migration in alloys with 3.9 to 30.5wt%Zn, at temperatures of between 573 and 773K, were analyzed. The temperature dependence of the mobility indicated a value of 177kJ/mol as the activation enthalpy for grain-boundary migration. This was close to the activation enthalpy (191kJ/mol) for the volume diffusion of Zn in Cu. Migration was considered to be controlled by a solute drag effect due to the volume diffusion of Zn in the Cu matrix in the neighborhood of the moving boundary.

Quantitative Analysis of Observations of Diffusion-Induced Grain Boundary Migration for Random Boundaries in the Cu(Zn) System using a Driving-Force Model. Y.Yamamoto, M.Kajihara: Acta Materialia, 1999, 47[4], 1195-201