An investigation was made of the diffusion of solder alloy components into alumina ceramics. Titanate compounds were identified, in ceramic layers which were adjacent to the joint, by means of X-ray diffraction. The concentration profiles of various elements in the cross-section of the alumina/solder joint were obtained and were used to deduce the diffusion coefficients. It was found that the diffusivity of Ni was 1.726 x 10-13m2/s at a nominal annealing temperature of 920C, while the diffusivities of Fe and Ag were 1.705 x 10-13 and 8.83 x 10-16m2/s, respectively.

A.Bien, M.Buda, W.Olesinska: Solid State Phenomena, 1995, 41, 277-84