The diffusion kinetics of chemical vapor deposited materials were studied by using electron microprobe techniques. Line scans of Ir and Re were fitted, and a diffusion model was used to deduce the diffusion coefficients (table 93). It was noted that the most rapid diffusion process was grain boundary diffusion, with Re diffusing down grain boundaries in the Ir over-layer.

J.C.Hamilton, N.Y.C.Yang, W.M.Clift, D.R.Boehme, K.F.McCarty, J.E.Franklin: Metallurgical Transactions, 1992, 23A[3], 851-6

 

 

 

Table 93

Interdiffusion of Ir and Re

 

Temperature (C)

D (cm2/s)

1400

7.0 x 10-12

1700

2.9 x 10-11

1900

4.7 x 10-11