Interaction between an electroless Ni-P deposit and liquid solder was investigated by means of X-ray diffractometry and scanning electron microscopy. It was found that Sn was the predominant diffusing atom, according to Auger electron spectroscopy. The associated activation energy was equal to about 29kJ/mol for a Sn concentration of 50wt%.

C.Y.Lee, K.L.Lin: Thin Solid Films, 1994, 249[2], 201-6