Plastically deformed sections, which acted as fast-diffusion paths, were created in monocrystalline conductor lines, with widths of about 2μ, by means of nano-indentation. Sections of various length were created in lines which had (111) and (110) planes parallel to the substrate. The lines were then subjected to accelerated electromigration. A critical section length was identified below which no electromigration damage occurred at a given current density. Sub-critical sections which were placed near to each other interacted so as to generate electromigration damage and failure. The results suggested that defects played a significant role in governing damage nucleation in near-bamboo lines. Monocrystalline lines with a (111) orientation had electromigration lifetimes which were an order of magnitude longer than those with a (110) orientation. The difference was attributed to void motion, shape changes and growth processes.

Electromigration in Single-Crystal Aluminum Lines with Fast Diffusion Paths Made by Nanoindentation Y.C.Joo, S.P.Baker, E.Arzt: Acta Materialia, 1998, 46[6], 1969-79