The evolution of stresses in the diffusion couple during solid-state amorphization reactions was monitored by means of substrate curvature measurements and X-ray diffraction techniques. The latter method permitted the independent determination of the contribution which changes in the stress-free lattice parameter made to the stress in the crystalline layers. The results indicated that the amorphous phase formed under a large tensile stress, which relaxed as the reaction proceeded. This stress in the amorphous phase was consistent with the volume change that was associated with the reaction. The stresses in the crystalline elemental phases were considerably lower and were unaffected by the reaction. Low-temperature Ni-ion bombardment increased the tensile stress in the diffusion couple. Large observed stress variations were not associated with variations in the effective interdiffusion coefficient.

Interdependence of Stress and Interdiffusion during Solid-State Amorphization in Ni-Hf. W.S.L.Boyer, M.Atzmon: Journal of Materials Research, 2000, 15[2], 463-75