An analytical and experimental investigation was made of the mechanisms of defect formation during the interdiffusion of these materials. It was found that the analytical model predicted a critical thickness, below which defects were not produced during this highly strained interdiffusion process. Transmission electron microscopic analysis of diffused buried layers of various thickness revealed a very good qualitative agreement with the present model.

R.L.Thornton, D.P.Bour, D.Treat, F.A.Ponce, J.C.Tramontana, F.J.Endicott: Applied Physics Letters, 1994, 65[21], 2696-8