Structure and Thermal Stability of Cu after Severe Plastic Deformation

Abstract:

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Evolution of structure of high-purity and commercially pure copper at severe plastic deformation (SPD) by high pressure torsion (HPT) at room temperature and in liquid nitrogen has been studied by transmission electron microscopy (TEM) and measurements of microhardness. Thermal stability of structure obtained by HPT has been investigated. Factors preventing from obtaining nanocrystalline structure in Cu are analyzed and possible ways of their overcoming are discussed.

Info:

Periodical:

Defect and Diffusion Forum (Volumes 297-301)

Edited by:

Andreas Öchsner, Graeme E. Murch, Ali Shokuhfar and João M.P.Q. Delgado

Pages:

1312-1321

DOI:

10.4028/www.scientific.net/DDF.297-301.1312

Citation:

V. V. Popov et al., "Structure and Thermal Stability of Cu after Severe Plastic Deformation", Defect and Diffusion Forum, Vols. 297-301, pp. 1312-1321, 2010

Online since:

April 2010

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Price:

$35.00

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