Characterization of the Intermetallic Compounds Formed during Hot Dipping of Electrical Steel in a Hypo-Eutectic Al-Si Bath

Abstract:

Article Preview

In order to improve the magnetic properties of electrical steels, it may be desirable to increase the Si and/or Al content of the steel. A possible and alternative route to realize this is through the application of an Al-Si-rich coating on the steel substrate using a hot dipping process, followed by a diffusion annealing treatment. Previously, a series of compositions were used for dipping, namely: pure Al, Al + 10wt% Si (hypo-eutectic composition) and Al + 25wt% Si (hypereutectic composition). After these dipping experiments, and the subsequent evaluation of the coating and its formed intermetallic phases, the use of a hypo-eutectic Al-Si-bath was recommended for further investigation, because of certain advantages: i.e. hypo-eutectic concentrations allow lower dipping temperatures and reduce the formation of ordered Fe-Si-structures that cause brittleness in the coating and substrate. The present work reports on the results obtained on materials that were hot dipped in a hypo-eutectic Al-Si bath. An Al + 1wt%Si bath was used to coat electrical steel substrates with different silicon contents with dipping times, varying between 0 to 20 seconds, after a preheating of the samples to a temperature of 700°C. A thorough characterization of the formed intermetallics was made by Scanning Electron Microscopy (SEM), Energy Dispersive Spectroscopy (EDS) and X-Ray Diffraction (XRD). Three different compounds were identified as Fe2Al5, FeAl3 and a nearly pure Al phase.

Info:

Periodical:

Defect and Diffusion Forum (Volumes 297-301)

Edited by:

Andreas Öchsner, Graeme E. Murch, Ali Shokuhfar and João M.P.Q. Delgado

Pages:

370-375

DOI:

10.4028/www.scientific.net/DDF.297-301.370

Citation:

I. I. Danzo et al., "Characterization of the Intermetallic Compounds Formed during Hot Dipping of Electrical Steel in a Hypo-Eutectic Al-Si Bath", Defect and Diffusion Forum, Vols. 297-301, pp. 370-375, 2010

Online since:

April 2010

Export:

Price:

$35.00

[1] Y. Houbaert, T. Ros-Yañez and M. Prado: Mat. Sci. Forum Vol. 373-376 (2001), p.733.

[2] G. Hameed Awan and Faiz ul Hasan: Mater. Sci. Eng. A. Vol. 472 (2008), p.157.

[3] H.R. Shahverdi, M.R. Ghomashchi, S. Shabestari and J. Hejazi: J. Mater. Process. Technol. Vol. 124 (2002), p.345.

[4] J. Barros, T. Ros-Yañez and Y. Houbaert: Defect Diff. Forum Vols. 237-240 (2005), p.1115.

[5] T. Maitra and S.P. Gupta: Mat. Charac. Vol. 49 (2003), p.293.

[6] K. Bouché, F. Barbier and A. Coulet: Mat. Sci. Eng. A Vol. 249 (1998), p.167.

[7] S. Kobayashi and T. Yakou: Mat. Sci. Eng. A 338 (2002), p.44.

[8] M.V. Akdeniz and O. Mekhrabov: Act. Mater. 46 (1998), p.1185.

[9] A. Bouayad, Ch. Gerometta, A. Belkebir, A. Ambari: Mat. Sci. Eng. A Vol. 363 (2003), p.53.

In order to see related information, you need to Login.