Physical Properties of Diffusive-Hardening Alloys of Copper with Gallium and Tin

Abstract:

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Gallium-based diffusive-hardening solders do not contain lead. These alloys have specific rheological properties. Their synthesis includes, as a rule, mechanical mixing of such initial components as gallium, copper and tin powders [1]. Then the metallic paste undergoes irreversible phase transformations forming a solid alloy with a specific structure. Here, we investigated microstructures of diffusive-hardened Cu-Ga-Sn alloys by SEM and EDX methods. Thermal diffusivity and heat conductivity of alloys mentioned above were studied by the laser flash method. Also differential scanning calorimetry (DSC) experiments were performed to obtain heat properties of the samples.

Info:

Periodical:

Defect and Diffusion Forum (Volumes 312-315)

Edited by:

Andreas Öchsner, Graeme E. Murch and João M.P.Q. Delgado

Pages:

301-305

DOI:

10.4028/www.scientific.net/DDF.312-315.301

Citation:

A.B. Shubin et al., "Physical Properties of Diffusive-Hardening Alloys of Copper with Gallium and Tin", Defect and Diffusion Forum, Vols. 312-315, pp. 301-305, 2011

Online since:

April 2011

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Price:

$35.00

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