Kirkendall Effect during Grain Boundary Interdiffusion in Polycrystalline Thin Films

Abstract:

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We consider the kinetics of chemical interdiffusion along the grain boundaries in stressed thin metal film attached to inert substrate. We show that the kinetics of stress relaxation in the film can be either accelerated or slowed down if compared with the same kinetics in a single-component film, depending on the difference of intrinsic GB diffusion coefficients of the two components. In the case of faster matrix atoms the tensile stress in the film significantly increases beyond its initial value at the beginning of interdiffusion process, while in the case of faster diffuser atoms the compressive stresses develop in the film at the intermediate stages of stress evolution.

Info:

Periodical:

Defect and Diffusion Forum (Volumes 323-325)

Edited by:

I. Bezverkhyy, S. Chevalier and O. Politano

Pages:

49-54

DOI:

10.4028/www.scientific.net/DDF.323-325.49

Citation:

L. Klinger and E. Rabkin, "Kirkendall Effect during Grain Boundary Interdiffusion in Polycrystalline Thin Films", Defect and Diffusion Forum, Vols. 323-325, pp. 49-54, 2012

Online since:

April 2012

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$38.00

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