Stress Field near Crack Close to Bonding Interface in Explosion Clad Plate

Abstract:

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Periodical:

Key Engineering Materials (Volumes 177-180)

Edited by:

T.X. Yu, Q.P. Sun and J.K. Kim

Pages:

87-92

DOI:

10.4028/www.scientific.net/KEM.177-180.87

Citation:

I. Oda et al., "Stress Field near Crack Close to Bonding Interface in Explosion Clad Plate", Key Engineering Materials, Vols. 177-180, pp. 87-92, 2000

Online since:

April 2000

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Price:

$35.00

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