Material Removal Mechanism in Dynamic Friction Polishing of Diamond

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Periodical:

Key Engineering Materials (Volumes 238-239)

Edited by:

Yongsheng Gao, Jun'ichi Tamaki and Koichi Kitajima

Pages:

235-240

Citation:

K. Suzuki et al., "Material Removal Mechanism in Dynamic Friction Polishing of Diamond", Key Engineering Materials, Vols. 238-239, pp. 235-240, 2003

Online since:

April 2003

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$38.00

[1] K. Suzuki, N. Yasunaga, T. Uematsu et al.: Dynamic friction polishing of diamond utilizing sliding wear by rotating metal disc, Proc. of ASPE (1996) 482-485.

[2] M. Iwai, T. Uematsu, K. Suzki, N. Yasunaga: High efficiency polishing of PCD with rotating metal disc, Proc. of ISAAT2001 (2001) 231-238.

[3] N. Ikawa, T. Tanaka: Wear of diamond abrasive grain in grinding pure iron, Journal of JSPE, 37-11 (1971) 824-828 (in Japanese).

[4] N. Yasunaga et al.: Generation of cementite in the reaction of diamond / pure iron, - An experiment for wear of diamond -, Journal of JSPE, 38-4 (1972) 413-415 (in Japanese).

[5] C.F. Yang, M. Yoshikawa: On polishing of diamond film with hot metal (The optimum polishing condition), Journal of JSPE, 57-1 (1991) 184-189 (in Japanese).

[6] M. Mochida, S. Moriya, T. Shimamune, A. Une: Polishing mechanism of CVD diamond with metallic disc wheel, Journal of JSPE, 67-4 (2001) 597-601 (in Japanese).

DOI: https://doi.org/10.2493/jjspe.67.597

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